A Review of Select Patented Technologies for Cooling of High Heat Flux Power Semiconductor Devices

The development of wide band-gap power electronics over the last two decades has stimulated a tremendous amount research into high performance liquid cooling solutions for heat flux (200-1000 W/cm $^{2}$ ) semiconductor devices. A patent literature search technologies was conducted in late-2000 time frame and promising thermal management were identified, at that time, development. These separated four categories classified as single-phase (i.e., liquid) jet impingement cooling, microchannel phase change or two-phase near-junction including direct chip cooling. In this Letter, perspective is provided on select patents from our group stem these technology areas 2010 to 2022. Additionally, thermal-fluid capability each briefly summarized. As whole, Letter provides demonstration historical significance mobility industry outlines future directions